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Daylight
Saving Time
begins Sunday, March 9. Set your clocks forward an hour.
It’s also a good time to check smoke detectors and the thermal resistance
of your isolators (see story at right). |
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 Q.
Why did St. Patrick drive all the snakes out of Ireland?
A. It was too far for them to crawl. |
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NVE’s
25-Year Anniversary |
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NVE is celebrating its 25-year anniversary in March.
The company was founded in March 1989 as Nonvolatile Electronics, Inc. by Dr. James M.
Daughton, a spintronics pioneer. Its first product, a ground-breaking GMR sensor,
was introduced in 1994.
NVE is planning to celebrate with the world’s largest birthday cake (the
current record is 130,000 pounds)*, and a spectacular fireworks display in the
company lobby.**
Some highlights of the past 25 years:
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Two EDN Hot 100 Product awards |
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An EE Product
News Top 20 Product |
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A Forbes Top Small Public Company four times
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An Electronic Business' 30 Best Small Electronics Company |
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Two Technology Fast 50 awards and a Fast 500 award |
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A Tekne Innovation Award |
*It might be scaled back to a half-sheet cake from Supervalu.
**Fireworks may be canceled due to safety issues.
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New
Distributor Down Under |
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G'day to our
new mates in Australia and New Zealand. Active
Components is now distributing NVE’s award-winning IsoLoop
Isolator product line.
Active Components has a number of offices in Australia and New Zealand, and is
considered the largest electronic component distributor in New Zealand.
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Recent
Exhibitions |
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Billed as the number one event for the embedded community, Embedded World
is underway in Nürnberg, Germany. Distributor HY LINE Power Components is
showing IsoLoop isolators. Isolated
Bus Transceivers are popular for embedded applications.
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From
the Application Desk |
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IsoLoop
Isolators Have
Excellent Thermal Characteristics
A frequent question to our Isolator applications desk is what is the thermal resistance
of our isolator packages.
Award-winning IsoLoop® Isolators have excellent thermal characteristics, enabling
the parts to run at high speed and high ambient temperatures with minimum temperature
rises. This provides wide operating margin and contributes to exceptional reliability.
Thermal-related terms and symbols are illustrated as follows:
Thermal Terms and Symbols
| Symbol |
Package |
Typ. |
Max. |
Units |
| θJA |
3
mm MSOP-8
0.15" SOIC-8
0.15" SOIC-16
0.3" SOIC-16 |
80
60
60
60 |
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°C/W |
| ΨJT |
3 mm MSOP-8
0.15" SOIC-8
0.15" SOIC-16
0.3" SOIC-16 |
40
10
10
20 |
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°C/W |
| PD |
3 mm MSOP-8
0.15" SOIC-8
0.15" SOIC-16
0.3" SOIC-16 |
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500
675
700
800 |
mW |
Thermal Specifications
for Popular IsoLoop Packages
(soldered to double-sided board; free air)
The junction-ambient thermal resistances for SOIC-8, narrow-body SOIC-16, and
wide-body SOIC-16 packages are similar. This is because higher case-to-ambient
thermal resistance in the smaller packages is offset by lower junction-case thermal
resistances since they are thinner and have relatively large leadframe areas.
This convenient coincidence allows one derating curve for three package types
(MSOP packages have higher junction-ambient thermal resistances).
For more information, download this bulletin:
More Info
(.pdf; Application Bulletin No. 24) > |
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